Modeling the Visco-Elastic Properties of Underfill Materials during Curing in IC Packaging
碩士 === 國立成功大學 === 機械工程學系專班 === 94 === Underfill is an alternative material for redistributing the stress induced by different coefficient thermal expansion (CTE) between materials in IC packaging. It is important to consider its viscoelastic behavior because the underfill material is polymer-based a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95379775720621714745 |