| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 94 === High speed is an important issue in semiconductor equipments, the main goal of an equipment is always to gain the maximum production at the shortest time, the dice need to be transferred frequently during the semiconductor back-end processes, the pick and place mechanism plays an important role in the semiconductor processing equipment.
Most of the Die Bonders of III-V semiconductor industry count on imported facilities, some domestic companies are capable of fabricating the equipment, the quality is still not as good as the imported ones since the dice and so fragile.
The development of high speed dices picking-and-placing mechanism with high stability is the immediate demand of the market. Aim to the mechanism development of Die Bonder’s picking-and-placing function, this thesis applied the technique of CAE, to simulate the characters of “high velocity of picking-and-placing mechanism”, the simulation included static, dynamic and modal analysis, this thesis also did optimization analysis by Taguchi method to design, the mechanism to a close to optimal condition, all these analysis can be used as reference for the design engineers.
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