Pick and Place Mechanism Analysis of a High-Speed Die Bonder
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 94 === High speed is an important issue in semiconductor equipments, the main goal of an equipment is always to gain the maximum production at the shortest time, the dice need to be transferred frequently during the semiconductor back-end processes, the pick and plac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60338871997221123921 |