Signal Integrity and Nondestructive Analysis of BGA Packaging for High Speed SOC Applications
博士 === 國立成功大學 === 電機工程學系碩博士班 === 94 === Microelectronic applications tend toward more complex components with higher integration at the system-on-a-chips (SoCs), higher speed, more functionality, and better performance. High speed I/Os, SIPs and memory cores are three key components in high speed So...
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| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61147190715707659972 |