The Research of Small Devices Binding by Fluidic Self-Assembly Techniques
碩士 === 國立成功大學 === 工程科學系專班 === 94 === Abstract Recently, more and more optical or semiconductor devices are getting smaller by new generation production process. How to reduce packing cost will be an important issue for smaller devices. Conventional “pick & place” assembly methods will get the bo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34134172462900677617 |