Investigation of the Fatigue Life of Lead-Free Solders for Flip Chip Chip Scale Package by Finite Element and Taguchi Method
博士 === 國立成功大學 === 工程科學系碩博士班 === 94 === The flip chip chip scale package (FCCSP) is different from conventional wire-bonding package by flipping the silicon chip over and connecting the solder bumps to the substrate directly. Because the flip chip package has excellent electrical properties, high I...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97189188986775443828 |