Analysis of Coupled Heat and Moisture Diffusion in materials

碩士 === 國立成功大學 === 土木工程學系碩博士班 === 94 === A model of coupling of moisture diffusion and heat conduction in solids is proposed. The distribution of temperature and moisture in materials with constant diffusivity is investigated. The analysis use eigenfunction expansion method and perturbation method to...

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Bibliographic Details
Main Authors: Chia-Chin Liu, 劉嘉欽
Other Authors: Jiann-Quo Tarn
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/04344920837933817337