Nanomechanical and Interfacial Properties of Electrochemically Deposited Copper and Nickel Films

• Main Authors: Yu-Shiuen Lee, 李育賢
• Other Authors: 張守一
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/10160380241670757192

碩士 === 國立中興大學 === 材料工程學系所 === 94 === In this study, Cu and amorphous Ni-P films were electrochemically deposited, and their mechanical properties and deformation mechanisms were investigated by nanoindentation test. The hardness and modulus of Cu film were measured as 2.1 and 120 GPa, respectively. A dislocation burst was observed at the indentation depth of 6 nm. The yielding strength and strain energy release rate were calculated as about 9 GPa and 2.7 J/m2, respectively. Creep of the Cu film occurred during indentation test, and the stress expont was measured as about 22. The hardness and modulus of Ni-P films increased with solution pH value from 6.1 and 146 GPa to 8.2 and 168 GPa, respectively. The formation and extension of shear bands were observed in the deformed region. The yielding strength and strain energy release rate were calculated as about 7.2 GPa and 3.0 J/m2, respectively. From the analyses of interface chemical bonding, it was found that the oxide on Cu surface was removed by plasma treatments, and Cu-Si bond formed at the Cu/SiCN interface. The Cu-N bond even formed after NH3 treatment. The adhesion strengths of non-treated, H2-treated, and NH3-treated Cu/SiCN interfaces were measured as 4.98, 5.90, and 5.99 J/m2 by nanoindentation test, and as 0.93, 1.74, and 2.46 J/m2 by nanoscratch test, respectively. The plasma treatments effectively enhanced the interface adhesion strength.