Nanomechanical and Interfacial Properties of Electrochemically Deposited Copper and Nickel Films
碩士 === 國立中興大學 === 材料工程學系所 === 94 === In this study, Cu and amorphous Ni-P films were electrochemically deposited, and their mechanical properties and deformation mechanisms were investigated by nanoindentation test. The hardness and modulus of Cu film were measured as 2.1 and 120 GPa, respectively....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10160380241670757192 |