| Summary: | 碩士 === 明新科技大學 === 化學工程研究所 === 94 === Abstract
Microelectronic Packaging is one of the critical technique in current electronic industry, in which solder joint plays an important role. The interaction between the solder and metallization layers usually tends to form the so-called intermetallic compounds (IMC) at the interface, which would then affect the interfacial properties of the solder joint and is strongly related to the reliability issues in the joint itself. It is thus crucial to establish a systematic approach to characterize the interfacial reaction in the joint to have a better understanding for the related phase transformation occurred in the solder joint.
The purpose of this study is to employ the most advanced electron probe microanalyzer(EPMA) to carry out the qualitative and quantitative analysis in the joint. The research would be focused on the optimization of the working procedure in the sample preparation and control of operation parameters in EPMA.A Monte Carlo based software was introduced to evaluate the variation of activation volume due to interaction between electrons and samples with respect to various accelerating voltage and testing materials. The materials under investigation included the lead-free solder Sn-Ag-Cu and Ni,Au,Al,P. In addition, several intermetallic compounds, such as Ni3Sn4,Cu6Sn5,Cu3Sn and related alloys of Ni-V and Ni-Sn-P were also studied.
Results of simulation from the Monte Carlo indicated that the penetration depth or the emitted range of X-ray for a specific material was increased in proportional to the acceleration voltage. Nevertheless, there was no siginificant variation in the activation volume or emitted range due to the change of the third element in the original binary IMC. Correlations between testing materials, including pure element, IMC and alloys, and accelerating voltage could be evaluated on the basis of series systematic studies of the Monte Carlo simulation. This would help to construct the date base for the qualitative and quantitative analysis in the choice of the operation parameters for EPMA. As a consequence, an optimal procedure in the characterization of solder joint in microelectronic package was proposed.
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