Optimal Procedure in the Characterization of Solder Joint in Microelectronic Package by Electron Probe Microanalyzer and Field-Emission Electron Probe Microanalyzer
碩士 === 明新科技大學 === 化學工程研究所 === 94 === Abstract Microelectronic Packaging is one of the critical technique in current electronic industry, in which solder joint plays an important role. The interaction between the solder and metallization layers usually tends to form the so-called intermetallic co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96027927700898088133 |