Reducing Dielectric Constant of Porous Silica Films by a Twice Modification Processing
碩士 === 逢甲大學 === 產業研發碩士班 === 94 === In this thesis, the characteristics of low-k porous silica films investigated with the single modification and two modification process. Ultra-low dielectric constant (low-k) porous silica films were successfully fabricated using a sol-gel process (molecular templa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08522431080825212995 |