The Study of Bonding Process in Plastic Microfluidics using UV Glue

• Main Authors: Wei-rei Tseng, 曾偉睿
• Other Authors: C. Shih
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/24633567497292629860

碩士 === 逢甲大學 === 化學工程學所 === 94 === The conventional bonding method for microfluidics utilized the thermal energy to raise the interfacial temperature to a temperature higher than Tg to form the joint between two substrates. However, the high temperature tends to deform the channel geometry and denature the reagents on the substrate. To overcome the problems mentioned above, a low temperature technique is proposed for bonding microfluidic structures. The experimental results showed that lower film thickness and higher adhesive viscosity result in better bonding efficiency. In addition, the space between the microchannels and the microchannel width also affect the bonding efficiency of the microstructures.