The Study of Bonding Process in Plastic Microfluidics using UV Glue
碩士 === 逢甲大學 === 化學工程學所 === 94 === The conventional bonding method for microfluidics utilized the thermal energy to raise the interfacial temperature to a temperature higher than Tg to form the joint between two substrates. However, the high temperature tends to deform the channel geometry and denat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24633567497292629860 |