Pulse Reverse Copper Plating in Through-Holes
碩士 === 逢甲大學 === 化學工程學所 === 94 === Industry at present adopt direct current join additive in the trough liquid to electroplate. This experiment studies the purpose in order to electroplate in the through-hole with all kinds of wave forms and electroplate in having additive and additive-free trough li...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39123776798483369938 |