Improve SMT solder-paste printing process quality through Six Sigma Approach
碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 94 === For following the light, thin, short, and small tendency of the consumption electronic products, the electronic assembly technology is also improving. The Surface Mount Technology (SMT) becomes the mainstream of the modern electron assembly industry. It reduc...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65036676926693594436 |