A Research of Visual Inspection Performance for IC Package of Clean Resin

• Main Authors: Tang Bao Yu, 余當寶
• Other Authors: WEN HUNG KUO
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/73804071844179295199

碩士 === 大葉大學 === 工業工程與科技管理學系碩士在職專班 === 94 === It will disease the functionality of IC if the clean resin used for packaging is without high transparency. There are two major issues resulting in that the yield of IC using the clean resin is much less than using with normal resin (black resin). First, some substance without ability of photography sensitization will be left on the resin. Second, the resin may be scraped during packaging. In additional, to pick up defect product highly depends on human labor. This cost is twice than general IC production. Therefore, this research would like to discuss four factors, which may directly influence the visual inspection performance. We find four factors by interviewing the company in our case and by reviewing the researches: work sheet, operation of inspection, continuous working time, and yield. Then, we follow the theory from professor Taguchi to design our experiments with two key indicators of inspection time and rate of wrong inspection. After the experiments, we find the following result: 1. “Work sheet (night-duty)” has no obviously impact for performance of inspection. 2. It has obviously improvement for performance of inspection by bring in semi-auto machine. 3. The period of continuous working time will affect the performance of inspection. The best is ten minutes after working two hours. 4. “Yield” has no obviously impact for performance of inspection.