A Research of Visual Inspection Performance for IC Package of Clean Resin
碩士 === 大葉大學 === 工業工程與科技管理學系碩士在職專班 === 94 === It will disease the functionality of IC if the clean resin used for packaging is without high transparency. There are two major issues resulting in that the yield of IC using the clean resin is much less than using with normal resin (black resin). First,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73804071844179295199 |