| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 94 === ABSTRACT
Due to the progress of the semiconductor industry and packaging technology, the demand of the on-line inspection system is also expanding. The mainstream technology in inspections focuses around die attach and Flip-Chip packaging. Using soldering or conductive adhesive, the manufacturing process of Flip-Chip deviates from standard wire conjoint module. The reliability of the chip is also affected due to the bond-line thickness. Thus, this paper focuses upon building the measurement system of bond-line thickness and die tilt.
Using traditional CCD to scan the object at high speeds and resolution by way of laser line scanning technology and coordinate mapping, the bond-line thickness and die tilt can be examined. Here the sample size is 15mm×15mm and the height is approximate 800~900μm from the substrate to die top interface. The known thickness of the dies is 800μm, with the bond-line thickness approximating 50~100μm. Examination results currently show the system resolution is 3.47μm.
This study targets the bond-line thickness of the die attach and Flip-Chip packaging, focusing upon online measurement systems and cost-efficient equipment; yet is also able to provide test results on other measurements such as online inspection of semiconductor components.
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