Measurements of Bond-line Thickness and Die Tilt in The Die Attach for Semiconductor Packaging Process
碩士 === 中原大學 === 機械工程研究所 === 94 === ABSTRACT Due to the progress of the semiconductor industry and packaging technology, the demand of the on-line inspection system is also expanding. The mainstream technology in inspections focuses around die attach and Flip-Chip packaging. Using soldering or co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47817622529195038991 |