A Formal Approach to the Heat - Driven Functional Unit Binding in High Level Synthesis
碩士 === 中原大學 === 電子工程研究所 === 94 === As the process shrinks into the deep sub - micron technology, the design complexity continues to increase. Therefore, the heat dissipation in a modern VLSI chip is skyrocketing. In this paper, we study the functional unit binding for heat dissipation. It is well kn...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/15299455566703191632 |