The sweep analysis of Q、S and M loops for semiconductor wirebonding technology
碩士 === 正修科技大學 === 機電工程研究所 === 94 === Nowadays, the trend of electric component is toward multi-function, high speed, high reliability and low cost, so Multi-Chip Module(MCM) and 3-Dimensional Package are the choice in the development of semiconductor package. A Multi-Chip Module (MCM) or 3-Dimension...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44061712500909375351 |