Stress Analysis of Flexible Packages
碩士 === 中華大學 === 機械與航太工程研究所 === 94 === Nonlinear finite element method was employed in the study to analyze the deformation and stress distribution of a new type of flexible flip chip packages under service conditions. Four procedures were simulated in the finite element analysis. Firstly, the packag...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63416459219295187740 |