Fracture Mechanics Study on The Intermetallic Compound Crack Behavior for The Solder Joint of Electronic Packages
碩士 === 中華大學 === 機械與航太工程研究所 === 94 === The crack behavior of the intermetallic compounds (IMC) for the solder joints of electronic packages under thermal cycling tests were analyzed using the finite element method in this research. The finite element method was employed to calculate the fracture-mech...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15576348822686072817 |