Investigation of Thermal-Induced Warpage of PBGA and Its Assembly
碩士 === 長庚大學 === 機械工程研究所 === 94 === Plastic Ball Grid Array (PBGA) package is popularly accepted in the electronic packaging industry, due to its special features with high input/output, low-profile, high heat dissipation, high electrical performance, and assembly self-alignment. However, coplanarity...
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| Format: | Others |
| Language: | zh-TW |
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2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69878047831185247753 |