Adaptive EWMA Control for Chemical Mechanical Polishing Process
碩士 === 長庚大學 === 化工與材料工程研究所 === 94 === As we know, chemical mechanism polishing (CMP) process takes a big weight in semiconductor industrial process. For the CMP process control, run-to-run (RtR) control is known as a suitable method which can always adjust the process recipe. EWMA (Exponentially Wei...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/81552953007845111556 |