Wafer Probe Testing Method For Environment Temperature Controlled And Probe Mark Analysis With Different Probe Needle Properties
碩士 === 國立中正大學 === 機械工程所 === 94 === Using the first period of method of testing of the department in IC manufacture process of probe card, probe have kept in touch in order to get bonding pad property of circuit. The chip is used in different environments, in order to guarantee that the chip can not...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77019864976697508265 |