Applications of Near Infrared Image Process Technique in the Alignment of GaAs Wafer
碩士 === 元智大學 === 機械工程學系 === 93 === For the current GaAs wafer processing such as dicing, die bonding, Filp-Chip bonding and inspection after assembly, all need the precision positioning of the wafer. Because it is unable to see through the wafer surface to detect the inside circuit for the alignment...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87320264256675677439 |