Solder Ball Thermal Fatigue and Mesh Model Analysis of Ball Grid Array Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 93 === The development of electronic product is toward lighter, thinner, shorter, higher power, and more functions, and the development of electronic package follows the same trend. The BGA (Ball Grid Array) package, designed for more I/O pins, is more popular nowada...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17806958686325645942 |