The preparation and Investigation of Electroless Copper Deposited Polyacrylontrile (PAN) Nano Composites for EMI ShieldingThe preparation
碩士 === 大同大學 === 材料工程研究所 === 93 === In this investigation, the electroless plating method was used to plate the Cu31S16 and Cu2-xS on the surface and inner of the polyacrylontrile (PAN) for electromagnetic interference (EMI) shielding. In this plating procedure, the PAN film was swollen before electr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94776589219422826422 |