A Study on Ultrasonic Assistant Activated Solder Applied on the Increased Thickness of Micromold

• Main Authors: Chih-Hua Chou, 周志鏵
• Other Authors: Cherng-Yuh Su
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/4geq96

碩士 === 國立臺北科技大學 === 製造科技研究所 === 93 === The aim of this research focuses on the topic of increasing thickness in micromold. A ultrasonic assistant activated solder process, which has some characteristics of low temperature, fast, and simplicity. The low and lead-free activated solder with some active elements can wet the surface between metals and ceramics. No metallization, fluxes, shielding gas, and vacuum chambers will be used during the process; in addition, it can achieve the goals for environments and mono-process. In this study, a set of ultrasonic assistant activated welding machine was designed for the bonding features of activated solder.Oscillation time, the welding methods and amplitude for SKD 11 tool steel, which is our base plate, will be discussed. The results reveal that the bonding will be finished by our equipment in the atmosphere if the activated solder and no fluxes are used. The analyses also show that the lowest ultrasonic amplitude and the residual stress are occurred at 15 seconds for oscillating. The interaction between base materials and solders is wetted very well and the ductile structure in the broken surface has excellent strength from the shear experiment and the best bonding strength is 25.03 Mpa. It will enhance the performance and benefits in the process for micromold.