A Study on Ultrasonic Assistant Activated Solder Applied on the Increased Thickness of Micromold
碩士 === 國立臺北科技大學 === 製造科技研究所 === 93 === The aim of this research focuses on the topic of increasing thickness in micromold. A ultrasonic assistant activated solder process, which has some characteristics of low temperature, fast, and simplicity. The low and lead-free activated solder with some active...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4geq96 |