Studies of Chemical Copper Plating and Kinetics behavior

• Main Authors: Tseng-Hsien Wu, 吳宗憲
• Other Authors: Jun-Shang Chang
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/75vh34

碩士 === 國立臺北科技大學 === 化學工程所 === 93 === We investigate electroless copper plating on poly ethylene terephthalate(PET) fabric, sheet, and other substrates. Discuss the effects of different operating conditions to deposition rate and morphology change on defferent substrates. We use optical microscope and Scanning Electron Microscope(SEM) observe surface structure with diffetent concentration of additive. Also we use four-point probe to discuss variation of surface resistance. Estimate effect of its electromagnetic interference shielding Effectiveness (EMISE) by surface resistance. Using X-ray Powder Diffractometer ; XRPD to discuss the structure of plated copper. We use Atomic Absorption spectrometer (AA) to determine variation of concentration of plating bath. During plating procedure, we use ultrasound agitation to see its effect to electroless copper plating and to derive kinetics equations.