Studies of Chemical Copper Plating and Kinetics behavior

碩士 === 國立臺北科技大學 === 化學工程所 === 93 === We investigate electroless copper plating on poly ethylene terephthalate(PET) fabric, sheet, and other substrates. Discuss the effects of different operating conditions to deposition rate and morphology change on defferent substrates. We use optical microscope an...

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Bibliographic Details
Main Authors: Tseng-Hsien Wu, 吳宗憲
Other Authors: Jun-Shang Chang
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/75vh34