Study of via first dual damascene process

碩士 === 南台科技大學 === 電子工程系 === 93 === Much progress has been made in the IC manufacturing. The feature size of 0.13 m, 90 nm 65 nm or below have been the main stream of the IC manufacturing. For the photolithography in the IC process, G-line, I-line, DUV (Deep-Ultra-Violet) and even EUV (Extreme-Ultra...

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Bibliographic Details
Main Authors: Lin Ling-Chieh, 林陵杰
Other Authors: Lin Yu-Shian
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/26892255189661670810