The Study of Printed Circuit Board Make by Kevlar and Teflon Fibre

• Main Authors: Yu-Chun Chen, 陳聿鈞
• Other Authors: Huang-Kuei Lee
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/81615259298821619304

碩士 === 中國文化大學 === 材料科學與製造研究所 === 93 === In this study we used polyamid fibre that because it has excellent properties such as low density, high tensile strength, high tensile modulus, low moisturecontent and few impure ions that affect electrical properties, in addition, these recycled aramid fibres have negative thermal expansion coefficient (TEC), and Teflon has excellent properties,like water- repellent, high density, Low friction, Flame Retardation, high electrical resistivity, etc. In the experimentation we used Kevlar fibre(mixed by length ratio 2cm：0.3mm=1：1) or NBKP fibre, addition the different rate of vinlon fibre or Teflon fibre and dispersants to make paper. Then measure the physical properties, after coating process, using the physical properties, mechanical properties and electric properties to estimate the feasibility of the application in industry。 The results we got from experiments that the Kevlar fibre with 10% Taily connecting fibre represents better in physics and mechanics on papers and substrates. Although the behavior is not good specially in electrics tests, the Kevlar fibre with 10% Taily connecting fibre still achieves the practice standard of industrial. The Kevlar fibre with 15% Spc-5211 connecting fibre has an outstanding results in electrical tests although it is not as good as Kevlar fibre with Taily in physics. In Kevlar mixing Taily fibre, the results from electrical tests are much better than front two materials when the addition of Taily is over 70% and also attain our expectation to lower the problems of decrease the water uptake of Kevlar fibre. In this way, we have probability of develop a high speed and frequency substrate. But we still have the problems that the properties of materials is not good enough in physics, so before expanding high performances substrate materials we have to continue our research to improve the ratio defects by techniques as coating and compression.