The Study of Printed Circuit Board Make by Kevlar and Teflon Fibre

碩士 === 中國文化大學 === 材料科學與製造研究所 === 93 === In this study we used polyamid fibre that because it has excellent properties such as low density, high tensile strength, high tensile modulus, low moisturecontent and few impure ions that affect electrical properties, in addition, these recycled aramid fibres...

Full description

Bibliographic Details
Main Authors: Yu-Chun Chen, 陳聿鈞
Other Authors: Huang-Kuei Lee
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/81615259298821619304