微元件內部垂直輪廓量測系統之研究
碩士 === 國立臺灣大學 === 機械工程學研究所 === 93 === Measuring the vertical profile inside a micro part is a difficult but important task, especially when micro holes are frequently encountered nowadays. However, when the interior dimension of the micro part is smaller than 1mm, the smallest dimension of the pin-b...
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ndltd-TW-093NTU054891702015-10-13T11:12:50Z http://ndltd.ncl.edu.tw/handle/37491148115662298757 微元件內部垂直輪廓量測系統之研究 Bing-Han Wu 吳秉翰 碩士 國立臺灣大學 機械工程學研究所 93 Measuring the vertical profile inside a micro part is a difficult but important task, especially when micro holes are frequently encountered nowadays. However, when the interior dimension of the micro part is smaller than 1mm, the smallest dimension of the pin-ball probe currently available for the coordinates measuring machines, there is practically no measuring apparatus available so far to serve the purpose. An approach by applying the capacitance-sensing principle to measure the interior vertical profile of a high aspect ratio micro part, such as a hole with 1.0mm diameter, is proposed and implemented. Experiments are conducted and the measurement accuracy is able to be reached to about 1um. The structure and the circuitry of the developed measuring system are both simple. Besides, the developed system is innovative and has a great potential for industrial application. Further study toward the measurement and assessment of the circularity and cylindricity of micro holes by the developed system is underway. Yun-Shiuan Liao 廖運炫 2005 學位論文 ; thesis 67 zh-TW |
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碩士 === 國立臺灣大學 === 機械工程學研究所 === 93 === Measuring the vertical profile inside a micro part is a difficult but important task, especially when micro holes are frequently encountered nowadays. However, when the interior dimension of the micro part is smaller than 1mm, the smallest dimension of the pin-ball probe currently available for the coordinates measuring machines, there is practically no measuring apparatus available so far to serve the purpose. An approach by applying the capacitance-sensing principle to measure the interior vertical profile of a high aspect ratio micro part, such as a hole with 1.0mm diameter, is proposed and implemented. Experiments are conducted and the measurement accuracy is able to be reached to about 1um. The structure and the circuitry of the developed measuring system are both simple. Besides, the developed system is innovative and has a great potential for industrial application. Further study toward the measurement and assessment of the circularity and cylindricity of micro holes by the developed system is underway.
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Yun-Shiuan Liao |
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Yun-Shiuan Liao Bing-Han Wu 吳秉翰 |
author |
Bing-Han Wu 吳秉翰 |
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Bing-Han Wu 吳秉翰 微元件內部垂直輪廓量測系統之研究 |
author_sort |
Bing-Han Wu |
title |
微元件內部垂直輪廓量測系統之研究 |
title_short |
微元件內部垂直輪廓量測系統之研究 |
title_full |
微元件內部垂直輪廓量測系統之研究 |
title_fullStr |
微元件內部垂直輪廓量測系統之研究 |
title_full_unstemmed |
微元件內部垂直輪廓量測系統之研究 |
title_sort |
微元件內部垂直輪廓量測系統之研究 |
publishDate |
2005 |
url |
http://ndltd.ncl.edu.tw/handle/37491148115662298757 |
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