Research of Silicon Wafer Thinning Technology
博士 === 國立臺灣大學 === 機械工程學研究所 === 93 === Abstract Silicon wafers are most extensively used materials for integrated circuit (IC) substrates. As the demand of miniaturization with higher performance standards for electronic devices such as memory cards, smart cards, portable communication devices, and p...
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| Format: | Others |
| Language: | zh-TW |
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2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43491641552303447644 |