Model Extraction and Analysis of Bonding Wires and Package Pins
碩士 === 國立臺灣大學 === 電信工程學研究所 === 93 === Recently, many contributions have been made in the full-wave analysis of package and interconnect discontinuities. Most of these contributions presented analysis of one aspect of package or one bonding wire, but very few account for multiple interacting structur...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03133189198844281628 |