Simple Yet Effective Algorithms for Block and I/O Buffer Placement in Flip-Chip Design
碩士 === 國立清華大學 === 資訊工程學系 === 93 === Flip-chip bonding was developed by IBM in 1964. Flip-chip bonding facilitates higher I/O counts, shorter interconnect routes, smaller power rails, and better thermal conductivity, all of which are important in high performance digital systems. In this thesis, we s...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/55906060241086552224 |