Reliability Analysis of Lead free CSP solder joint under different surface finishing
碩士 === 國立清華大學 === 動力機械工程學系 === 93 === Abstract The combinations of one kind lead free solder(Sn/Ag3.8-4.0/Cu0.5-0.7) and two kinds of surface finishing (OSP and ENIG) were investigated. By suitable design of PCB board, the analyze of single joint reliability during the four point cycle bending cou...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87424391508792780670 |