Thermal characteristics in Flip-Chip solder joint during current stressing
碩士 === 國立清華大學 === 動力機械工程學系 === 93 === Flip chip technology has been adopted for high-density packaging due to its excellent electrical performance and better heat dissipation ability. As the required performance in microelectronic density becomes higher, the current that each bump needs to carry has...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18832719543848787316 |