The Development of the Precision Solder-Ball Measuring System
碩士 === 國立屏東科技大學 === 機械工程系 === 93 === The aim of this thesis is to develop an automatic and accurate measurement system for measuring the sphericity and diameter of the tin solder balls applying in the BGA chip assembling industry. We can measure a lot of the solder balls’s size at one batch samples...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84080949170326343695 |