Study the Microstructure of Au20Sn Solder in the Optoelectronic Packaging
博士 === 國立中央大學 === 化學工程與材料工程研究所 === 93 === The good mechanical property, high thermal conductivity and high electrical conductivity of alloy make it widely used in optoelectronic packaging. Among of all hard solders, Au20Sn (wt.%) solder has the lowest melting point and good high strength and therefo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05783224885182213555 |