Life Cycle Assessment of PBGA Substrates
碩士 === 國立交通大學 === 工學院碩士在職專班產業安全與防災學程 === 93 === PBGA substrates are the key material of semiconductor chips during packaging process. They are the bridge connecting external circuits of the IC chips. Because the PBGA packaging method is a break-through over the original Peripheral Packaging techniqu...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16644870267962710866 |