Electrocoagulation Treatment for CMP Wastewater - Factors Affecting Operation and Reaction Mechanism
碩士 === 國立交通大學 === 環境工程系所 === 93 === Chemical mechanical polishing (CMP) has emerged as a preferred planarization technic in the manufacturing of multilevel integrated circuits. This process not only consumes large amount of ultra-pure water (UPW) but also produces great quantity of wastewater which...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16907551121594810787 |