Design of a High Speed Mechanism for Chip's Pick and Place

碩士 === 國立交通大學 === 機械工程系所 === 93 === High speed is an important issue in the semiconductor processing equipment. In usual, the chip need to be transferred frequently in the semiconductor back-end processing; therefore the pick and place mechanism plays an important role in the semiconductor processin...

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Bibliographic Details
Main Authors: Chee-Yong Teo, 張志榮
Other Authors: Chung-Biau Tsay
Format: Others
Language:en_US
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/60875706482568780689