Study of 40 GHz Coplanar Waveguide to Coplanar Waveguide Hot-Via Interconnect
碩士 === 國立交通大學 === 材料科學與工程系所 === 93 === Abstract The performance of the integrated circuits is mainly dependent on the minimization of the size. Traditional wire bonding has restrictions on high speed and high frequency integrated circuits performance. Therefore, flip-chip bonding technology was use...
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| Format: | Others |
| Language: | zh-TW |
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2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06335659984798312784 |