Distribution of Material Temperature in the Tape-Automated-Bonding Packaging Process
碩士 === 國立交通大學 === 工學院碩士在職專班精密與自動化工程學程 === 93 === Tape-automated-bonding (TAB) process is one of the modern assembly technologies of electronic display devices. In this process, anisotropic-conductive-film (ACF) glue is used and heated to cure so as to connect the panel lead and the tape-carrier-pack...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/56585877009076050344 |